Intelligent Volume Control Ultrasonic Atomization Spraying Equipment

Raws li cov khoom tseem ceeb nyob rau hauv siab -kawg manufacturing teb xws li semiconductors thiab zaub vaj huam sib luag, txheej zoo ntawm photoresist ncaj qha txiav txim siab qhov tseem ceeb ntawm cov cim qhia xws li nti daws teeb meem thiab vaj huam sib luag pixel ceev. Cov txheej txheem txheej txheem txheej txheem photoresist feem ntau yog siv cov txheej txheem spinning, uas, thaum yooj yim rau kev khiav lag luam, muaj cov kev txwv tseem ceeb: Ua ntej, kev siv cov khoom siv tsawg (tsuas yog 30% -40%), nrog rau qhov loj ntawm photoresist nkim vim lub zog centrifugal, nce nqi ntau lawm; Qhov thib ob, txheej txheej yog txwv los ntawm qhov loj me ntawm cov substrate, nrog cov wafers loj los yog hloov pauv tau yooj yim rau "ntug nyhuv" ntawm cov npoo tuab thiab cov chaw nyias nyias; thib peb, txheej thickness tswj precision tsis txaus, ua rau nws nyuaj rau ua tau raws li qhov yuav tsum tau nruj me ntsis ntawm cov txheej txheem siab heev (xws li chips hauv qab no 7nm) rau nanoscale coatings; thiab thib plaub, qhov tsis xws luag xws li npuas thiab pinholes tau yooj yim tsim, cuam tshuam rau kev ncaj ncees ntawm cov qauv photolithography.

Nrog rau cov evolution ntawm semiconductor chips mus rau ntau dua ntom ntom thiab me me, thiab tso saib panels rau qhov loj me me thiab yooj yim dua, photoresist txheej ceev xav tau cov thev naus laus zis tshiab uas sib xyaw ua haujlwm siab, kev siv siab, thiab tus nqi qis. Ultrasonic atomization txau cov cuab yeej, nrog nws txoj cai atomization tshwj xeeb, tau dhau los ua cov kev daws teeb meem tseem ceeb los daws cov teeb meem no.

Daim Ntawv Thov Tseem Ceeb Scenario hauv Kev Lag Luam Photoresist:

◆ Semiconductor Chip Photoresist Txheej: Hauv kev tsim cov logic chips thiab nco chips (xws li DRAM thiab NAND), ultrasonic atomization spraying tuaj yeem siv rau hauv qab los tiv thaiv-paj rwb thaiv tsev (BARC), lub ntsiab photoresist txheej, thiab sab saum toj anti-reflective txheej (TARC) ntawm wafer nto. Rau cov txheej txheem ultraviolet (EUV) lithography, cov cuab yeej tuaj yeem ua tiav ultra-nyias (tsawg dua lossis sib npaug rau 100nm), qis-roughness (Ra Tsawg dua lossis sib npaug li 0.5nm) cov txheej txheem photoresist, txhim kho qhov kev daws teeb meem thiab ntug roughness (LER) kev ua tau zoo ntawm cov qauv lithography.

◆ Photoresist Txheej rau Cov Vaj Huam Sib Luag: Hauv kev tsim cov txheej txheem ntawm pixel txhais txheej (PDLs), cov xim lim (CFs), thiab kov cov electrodes hauv LCD thiab OLED cov duab vaj huam sib luag, cov khoom siv tuaj yeem hloov kho kom haum rau cov tsho loj -size substrates (xws li G8.5 thiab G10.5), daws cov teeb meem warpage PI thaum txheej txheej ntawm OLED txhim kho qhov adhesion ntawm photoresist thiab substrate thiab txo cov qauv offset hauv kev txhim kho thiab etching txheej txheem.

◆ Photoresist Txheej rau MEMS thiab Advanced Ntim: Hauv microelectromechanical systems (MEMS) thiab cov ntim ntim siab heev (xws li WLCSP thiab CoWoS), photoresist feem ntau yog siv los ua ib qho kev sib txuas ib ntus, txheej passivation, lossis qauv hloov nruab nrab. Ultrasonic atomization spraying tuaj yeem ua tiav cov txheej txheem sib txawv ntawm peb- cov qauv sib txawv (xws li qhov sib piv siab ntawm cov trenches thiab pob arrays), ua kom ntseeg tau tias muaj kev ncaj ncees ntawm cov txheej txheem txheej hauv ib qho chaw kaw thiab ua tau raws li qhov siab - cov kev xav tau ntawm cov txheej txheem ntim khoom.

◆ Tshwj xeeb Functional Photoresist Txheej: Rau kev ua haujlwm tshwj xeeb photoresists xws li photosensitive resins thiab quantum dot photoresists, cov cuab yeej tuaj yeem tswj cov atomization tsis meej kom tsis txhob sib sau ua ke ntawm cov khoom ua haujlwm (xws li quantum dots thiab nanofillers), tswj qhov kev ua tau zoo ntawm optical thiab photolithographic rhiab heev ntawm daim ntawv thov, kev hloov pauv ntawm cov duab rhiab heev, kev paub thiab lwm yam.