Yuav Ua Li Cas Ultrasonic Spray Txheej Txhim Kho Photoresist Daim Ntawv Thov?

Taw qhia

Photoresist txheej yog txheej txheem tseem ceeb hauv kev tsim khoom semiconductor, microelectronics, MEMS, sensors, thiab lwm yam kev lag luam precision. Qhov zoo thiab tsis sib xws ntawm cov txheej txheem photoresist ncaj qha cuam tshuam rau tom qab raug, kev loj hlob, etching, thiab cov txheej txheem hloov pauv.

Cov txheej txheem spinning yog dav siv rau daim ntawv thov photoresist, tab sis nws tuaj yeem muaj kev txwv thaum ua tsis yog -planar substrates, peb- cov qauv, wafers nrog rau saum npoo av, los yog cov ntaub ntawv uas txheej txheej thiab kev siv cov khoom tseem ceeb.

Ultrasonic spray txheej tshuabmuab lwm txoj kev daws teeb meem. Los ntawm kev siv siab- zaus ultrasonic vibration rau atomize kua photoresist mus rau hauv cov dej zoo thiab zoo ib yam, ib qho tshuaj tsuag ultrasonic tuaj yeem tsim cov tshuaj tsuag rau nyias - zaj duab xis deposition.

Cov txheej txheem hauv paus yog:

Photoresist → Ultrasonic Atomization → Fine Droplets → Tswj Txau → Uniform Photoresist Film

Tsis zoo li cov pa pneumatic txau, ultrasonic atomization tsis cia siab feem ntau ntawm siab - cua siab los ua kom cov kua ua kua. Siab - zaus vibration ntawm nozzle nto tsim cov txheej txheem atomization.

Cov tshuaj txau tuaj yeem tswj tau los ntawm qhov tsis muaj xws li ultrasonic zaus, kua ntws tus nqi, tshuaj tsuag qhov deb, nozzle txav, thiab substrate ceev.

Vim li cas Siv Ultrasonic Atomization rau Photoresist?

1. Uniform Nyias- Zaj duab xis txheej

Ultrasonic atomization tuaj yeem tsim cov tee dej zoo nrog cov tee nqaim heev -loj faib. Thaum cov tshuaj tsuag tsis ua kom zoo, cov tee dej tuaj yeem muab tso ncaj qha rau ntawm qhov chaw substrate.

Qhov no yog tshwj xeeb tshaj yog pab tau rau daim ntaub ntawv uas yuav tsum tau tswj thiab uniform photoresist thickness.

2. Precise Material Deposition

Photoresist tuaj yeem yog cov khoom kim heev, yog li kev txo cov khoom siv tsis tsim nyog yog qhov tseem ceeb.

Ultrasonic spray txheej tso cai rau cov kua dej ntws los tswj tau meej. Piv nrog cov tshuaj tsuag cov pa uas siv cov cua compressed ntau ntau, cov txheej txheem tuaj yeem txo qis overspray thiab txhim kho kev siv cov khoom siv.

3. Tsim nyog rau Complex Surfaces

Spin txheej ua haujlwm zoo tshaj plaws ntawm cov txheej txheem tiaj tus. Ultrasonic spray txheej muab ntau dua yooj rau txheej:

3D qauv

Microstructured substrate

MEMS cov khoom

Tsis yog -planar nto

Structured wafers

Loj - cheeb tsam substrates

Cov khoom siv hluav taws xob tshwj xeeb

Cov tshuaj tsuag tuaj yeem ncav cuag thaj chaw uas tej zaum yuav nyuaj rau txheej txheej uas siv cov txheej txheem sib tsoo.

4. Tsawg-Veocity, tswj tshuaj tsuag

Ultrasonic atomization tuaj yeem tsim cov tshuaj tsuag mos thiab tswj tau. Qhov no ua rau nws tsim nyog rau cov ntawv thov uas muaj kev cuam tshuam ntau dhau los yog kev kub ntxhov yuav tsum tau txo qis.

Cov yam ntxwv tshuaj tsuag tuaj yeem hloov kho los ntawm kev hloov pauv ultrasonic zaus, kua pub tus nqi, lub nozzle - mus rau - substrate deb, thiab scanning ceev.

5. Txheej Txheej Txheej Thickness Tswj

Photoresist thickness yog cuam tshuam los ntawm ntau yam txheej txheem tsis. Nrog rau kev tshuaj tsuag ultrasonic, txheej thickness tuaj yeem hloov kho los ntawm yam xws li:

Photoresist concentration

Cov kua dej ntws

Ultrasonic zaus

Txau deb

Nozzle scanning ceev

Tus naj npawb ntawm txheej dhau

Substrate kub

Qhuav tej yam kev mob

Qhov no tso cai rau cov txheej txheem txheej yuav tsum tau optimized rau txawv photoresist formulations thiab substrate yuav tsum tau.

Photoresist txheej yuav tsum tau tswj kom meej ntawm zaj duab xis thickness, uniformity, cov khoom siv, thiab substrate coverage.Ultrasonic spray txheej tshuabmuaj ib txoj hauv kev yooj yim rau kev tso cov photoresist, tshwj xeeb tshaj yog thaum ua haujlwm nrog cov yeeb yaj kiab nyias, cov txheej txheem nyuaj, lossis cov txheej txheem uas nyuaj rau kev siv cov txheej txheem sib tsoo.