Dab tsi yog Ultrasonic Photoresist Spraying?

Ultrasonic photoresist txheej khoom yog cov cuab yeej tshwj xeeb rau photoresist txheej raws li kev siv tshuab ultrasonic atomization. Nws yog feem ntau siv nyob rau hauv precision manufacturing teb xws li semiconductors, panels, wafers, MEMS, thiab photovoltaics. Nws atomizes photoresist rau hauv nano/micron-sized ultrafine droplets, uniformly txau rau saum npoo ntawm substrates xws li wafers thiab iav substrates, hloov tsoos spin- txheej thiab dip- txheej txheem txheej.

 

Cias muab, nws yog cov cuab yeej tseem ceeb hauv "tiv thaiv txheej txheej" ntawm cov txheej txheem photolithography, boasting qhov zoo xws li siab precision, siab uniformity, tsis tshua muaj zog noj, thiab tsis swirling / tuab ntug tsis xws luag, ua rau nws haum rau lub photoresist txheej txheej txheem ntawm advanced txheej txheem.

 

Core technology zoo(piv rau tsoos spin txheej / dip txheej)

Photoresist coating is a crucial pre-process step in photolithography, and the uniformity of film thickness directly affects the accuracy of photolithography. Cov txiaj ntsig tseem ceeb ntawm cov cuab yeej siv tshuaj tua ultrasonic deb tshaj cov txheej txheem ib txwm muaj, uas tseem yog qhov laj thawj tseem ceeb rau nws txoj kev siv dav hauv cov txheej txheem tsim khoom.

 

1. Ultra- txheej txheej siab:Zaj duab xis thickness uniformity Tsawg dua los yog sib npaug li ± 1%, tshem tawm "thick edges thiab concave centers" ntawm spin txheej, haum rau photolithography cov txheej txheem siab heev xws li 7nm / 5nm;

 

2. Tsis tshua muaj photoresist noj:Spin txheej muaj qhov kev siv hluav taws xob photoresist tsuas yog 10 ~ 20%, thaum cov tshuaj tsuag ultrasonic tuaj yeem ncav cuag 80 ~ 95%, txo tus nqi ntawm photoresist (siab- nqi siv tau);

 

3. Wide controllable zaj duab xis thickness ntau:Muaj peev xwm txheej nyias zaj duab xis los ntawm 10nm mus rau 100μm, haum rau ob qho tib si ultra- nyias thiab tuab photoresist txheej (xws li, ntim photolithography, MEMS tob qhov photolithography);

 

4. Tsis muaj kev puas tsuaj rau kev ntxhov siab:Tsis muaj centrifugal quab yuam los yog siab - ceev substrate rotation, tsis txhob wafer / substrate warping thiab cracking, haum rau fragile substrates (xws li, ultra- nyias wafers, hloov tau yooj yim substrates);

 

Adaptable rau complex substrates:Adaptable rau complex substrates: tuaj yeem tsho tsis yog -planar substrates, qhov tob / Grooved substrates, loj- thaj tsam substrates, thiab cov duab tsis zoo uas tsis tuaj yeem ua tiav los ntawm cov txheej txheej

 

Ib puag ncig tus phooj ywg thiab muaj kuab paug-dawb:Kev siv cov kua nplaum tsawg, tsis tshua muaj pa paug kua ntim, tsis muaj kua nplaum nplaum splattering zoo li hauv cov txheej txheej, ua kom tau raws li kev tsim khoom huv si.